1. Crystallography and Product Fundamentals of Silicon Carbide
1.1 Polymorphism and Atomic Bonding in SiC
(Silicon Carbide Ceramic Plates)
Silicon carbide (SiC) is a covalent ceramic compound composed of silicon and carbon atoms in a 1:1 stoichiometric proportion, distinguished by its amazing polymorphism– over 250 recognized polytypes– all sharing strong directional covalent bonds but varying in stacking sequences of Si-C bilayers.
One of the most highly relevant polytypes are 3C-SiC (cubic zinc blende structure), and the hexagonal types 4H-SiC and 6H-SiC, each exhibiting subtle variations in bandgap, electron movement, and thermal conductivity that affect their suitability for specific applications.
The strength of the Si– C bond, with a bond power of around 318 kJ/mol, underpins SiC’s remarkable hardness (Mohs firmness of 9– 9.5), high melting factor (~ 2700 ° C), and resistance to chemical deterioration and thermal shock.
In ceramic plates, the polytype is commonly picked based on the intended use: 6H-SiC is common in structural applications because of its ease of synthesis, while 4H-SiC dominates in high-power electronics for its exceptional charge service provider flexibility.
The large bandgap (2.9– 3.3 eV depending upon polytype) also makes SiC a superb electric insulator in its pure kind, though it can be doped to function as a semiconductor in specialized digital devices.
1.2 Microstructure and Phase Purity in Ceramic Plates
The performance of silicon carbide ceramic plates is critically dependent on microstructural functions such as grain dimension, density, stage homogeneity, and the presence of secondary stages or pollutants.
Top quality plates are generally made from submicron or nanoscale SiC powders with sophisticated sintering techniques, causing fine-grained, completely dense microstructures that take full advantage of mechanical toughness and thermal conductivity.
Pollutants such as cost-free carbon, silica (SiO TWO), or sintering help like boron or aluminum should be very carefully managed, as they can develop intergranular movies that lower high-temperature toughness and oxidation resistance.
Recurring porosity, also at reduced levels (
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